Brief introduction
| model | HongJin-H2535 |
| Specification | 30G/branch |
| characteristic | HongJin-H2535 is a one-component epoxy resin adhesive that is very suitable for low temperature and fast curing on SMT. It can still maintain a stable shape without drawing, overflowing, and collapse in ultra-high-speed micro-coating. It is stable in storage and has Excellent thermal shock resistance and electrical properties, safe to use, and fully comply with environmental protection requirements. |
| Applicable Products | Bonding and fixing of electronic components |
Technical parameter
| Attributes | magnitude |
| type | epoxy glue |
| viscosity（at 25°） | 38000±10000(mPa·s) |
density（g/cm3） | 1.4±0.2 |
| hardness（Shaw BrothersD） | 80+/-15 |
Shear force（MPa）（Fe/Fe） | 10Min. |
water absorption | ＜1.0% |
Dielectric constant（1MHz） | 100% |
surface resistance（Ω） | 1.2×1012 |
Operation time（After opening） | 12H |
Precautions
1、Please store glue at -20°C.
2、Warm up the glue at room temperature for 2 hours before use.
3、Before bonding, the bonding surface must be kept clean and free from water, oil, rust, etc. Better after sanding.
4、After dispensing, please strictly follow the conditions recommended in the specification.
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Mail ：sales@szhjtec.com
contact ：吳先生 18688927121
王先生 13332958891
address ：深圳市龍崗區坪地街道教育北路49號5B棟501
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