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Brief introduction
model | HongJin-T5100 |
Specification | 2600ml/branch |
characteristic | HongJin-T5100 is a two-component addition type high thermal conductivity potting compound. It is heated and cured, and the higher the temperature, the faster the curing. This product does not produce any by-products in the curing reaction, and can be applied to the surface of PC (Poly-carbonate), PP, ABS, PVC and other materials and metal surfaces, and can be used in the environment of -40 ℃ to 200 ℃. |
Applicable Products | Potting heat dissipation protection for power modules; Potting heat dissipation protection for other electronic components |
Technical parameter
technical parameter | Acomponent | Bcomponent | |
Before curing | Exterior | light blue fluid | Platinum Fluid |
Viscosity(cps) | 10000~20000 | 12000~20000 | |
The mixing ratioA:B(cps) | 1:1 | ||
Viscosity after mixing(cps) | 10000~10000 | ||
Room temperature applicable time(min) | 60~90 | ||
Room temperature molding time(h) | 3~6 | ||
After curing | hardness(ShaoA) | 35~65 | |
Thermal Conductivity(W/M·K) | ≥2.0 | ||
Dielectric strength(KV/mm) | ≥13 | ||
Dielectric constant(1.0MHz) | 2.8~3.3 | ||
Volume resistivity(Ω·cm) | ≥1.0×1013 | ||
proportion | 2.5±0.5 |
Precautions
1、Organotin compounds and other organometallic compounds.
2、Silicone rubber containing organotin compounds.
3、Sulfur, polysulfides, polysulfones and other sulfur-containing materials.
4、Amines, urethanes, or other amine-containing materials.
5、Unsaturated hydrocarbon plasticizer.
This product needs to be stored in a ventilated and cool place below 30℃. When using it for the first time, the colloid of each component should be stirred evenly in advance to prevent uneven sedimentation of the components, and then fully mixed according to the specified proportion. Vacuum degassing is required when adding to the product. Care should be taken to avoid contact with the following substances during use.
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